GENERAL CHAIRS:
David Pan,
Univ. of Texas - Austin
Jacob Abraham,
Univ. of Texas - Austin

PROGRAM CHAIRS:
Ranjit Gharpurey,
Univ. of Texas - Austin
ANALOG
Ka Leung
Silicon Labs
ARCHITECTURE
Mattan Erez,
Univ. of Texas - Austin
CAD/EDA
Michael Solka,
Coherent Logix
DIGITAL
Mike Seningen,
Intrinsity

TUTORIALS:
Andreas Gerstlauer,
Univ. of Texas - Austin
POSTERS:
Mattan Erez,
Univ. of Texas - Austin

PUBLICITY CHAIR:
Stephanie Peco,
Univ. of Texas - Austin

PROGRAM COMMITTEE:
Magdy Abadir,
Freescale
Willie Anderson,
Qualcomm
Fares Bagh,
Advent Solar
Ramyanshu (Romi) Datta
Texas Instruments
Anirudh Devgan,
Magma
Kevin Nowka,
IBM
Vojin Oklobdzija
Univ. of Texas - Dallas
John Paulos,
Consultant
Ramin Poorfard,
Silicon Labs
Nur Touba,
Univ. of Texas - Austin
Mike Warner,
Mentor Graphics
Ron Waters,
TSMC

TECHNOLOGY AND MARKETS:
A Vision for Growth

Ken Hansen,
Senior Fellow,
Vice President and Chief Technology Officer
Freescale Semiconductor

As economies the world over seek to overcome the recent downturn, the primary engine that will drive growth will be technological innovations.  Three fundamental market forces are shaping the market today and foreseeably into the future: Health and Safety, Going Green, and the Net Effect.  These market trends and their derivatives will provide new growth opportunities for semiconductors and will also require innovation to provide value along different dimensions.  This keynote will address the innovation pipeline in embedded electronics and present a vision for growth driven by semiconductors. More...

Lighting up Dark Silicon

Krisztián Flautner
Vice President of Research and Development
ARM Ltd

Classical process scaling in silicon technology seems to be dead and living up to expectations requires continuous innovation at many levels, which comes at steadily progressing implementation and design costs. Solutions to problems need to cut across layers of abstractions and require coordination between software, architecture and circuit features. More...

Coming Soon! VLSI in 3D...
(Design and Methodology Considerations of 3D Integration)

Gary Carpenter
IBM Austin Research Laboratory

This tutorial will examine key technologies being developed in industry and in academia that are enabling 3D-VLSI, will explore some of the new challenges and implications they present to current 2D design methodologies, and will present some of the design and system considerations in applying 3D VLSI. More...

Silicon-based Millimeter-Wave Multiple-Antenna Transceivers:
From Beamforming to Baseband

Harish Krishnaswamy
Professor
Columbia University

The first segment of this talk will cover new architectures and circuit concepts that exploit silicon integration for the implementation of high-performance multiple-antenna transceivers at low area and power consumptions. The second segment of this talk focuses on the implementation of power-efficient high-data-rate baseband processors for mm-Wave transceivers. More...

Designing Multi-Processor and
Multi-Core Systems-on-Chip

Andreas Gerstlauer
Assistant Professor
University of Texas at Austin

Multi-Processor System-on-Chip (MPSoC) design requires high speed models for early verification and performance evaluation. As a result, electronic system level (ESL) modeling has moved up in abstraction from cycle accurate RTL to timed and untimed transaction-level models (TLMs). However, the open question is how to get from a high level system description to a hardware/software implementation? More...

2009 Sponsors

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Joint Chapter
Solid-State Circuits
Circuits & Systems

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